Grinding and Slicing Equipment


Manufacturer
Measurement Description
K.O. Lee Slicers (6" x 12")Surface grinding, including matching layers and ceramics:
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  • Capable of holding close tolerances.
  • >>>>
  • Capable of reducing the material
    __thickness down to 0.002" in 1 micron
    __increments.
  • >>>>
  • Used for material sizes up to 4 " x 8".
  • K.O. Lee Grinder
    (6"x12"--6" wheels)
    Vertical spindle grinding with cup wheels:
    >>>>
  • Capable of holding very close tolerances
    __to 2 microns.
  • >>>>
  • Capable of grinding anything that is
    __hard and difficult to grind -- such as
    __ceramics and alumina titanium carbide.
  • K.O. Lee Tool and Cutter GrinderCylindrical grinding:
    >>>>
  • Used for special angles and wafer
    __reclaiming.
  • >>>>
  • Used for ceramics.
  • K.O Lee SlicerSlicing:
    >>>>
  • Auto-indexing
  • >>>>
  • Capable of holding tolerances to
    __ 0.002".

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